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Step Stencils

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Step Stencils

Features

Smart SMT Tools step stencil technology offers you significant flexibility in achieving the right solder paste volume deposit for devices with markedly diverse paste requirement. They can provide additional paste height in selected areas of the PCB (step-up stencils) or reduced height deposits in other areas (step down stencils). Ideal for situations below:

• Half-etching process with solder pastes first due to production demand.

• Material thickness is reduced in areas to optimally match the soldering paste volumes

• Material thickness is reduced in areas to ensure surface texture and appearance.

• The circuit board shield frame needs to be tinned to increase adhesion.

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Stencil type:
Framework
Non-framework
Size(mm):
  • 280*380mm(valid area 190*290MM)
  • 300*400mm(valid area 140*240mm)
  • 370*470mm(valid area 190*290mm)
  • 410*520mm(valid area 240*340mm)
  • 450*550mm(valid area 270*370mm)
  • 520*520mm(valid area 340*340mm)
  • 584*584mm(valid area 380*380mm)
  • 550*650mm(valid area 350*450mm)
  • 736*736mm(valid area 500*500mm)
Stencil Side:
Top
Bottom
Top+Bottom(On Single Stencil)
Top+Bottom(On Separate Stencil)
Thickness:
0.10mm(4mil)
0.12mm(5mil)
0.15mm(6mil)
0.2mm(8mil)
Existing fiducials:
None
Half-lasered
Lasered through
Electropolishing:
Yes
No
Other special request:

*Your order will be sent directly to Smart SMT Tools and we will reply to you in 2-8 hours.

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*Please only upload jpg, jpeg, png, pdf, cdr, zip, rar. And only upload file under 10MB.

step why

Why Choose Custom SMT Stencil

See our advantages:

1. Step stencils provide optimum solder paste volume control

2. Step stencil can eliminate two print processes in some cases (when some components on the same board need higher paste height/volume compared with other areas)

3. Single step stencil can replace multiple stencils (using step process we can have multiple images at different thickness on same stencil)

4. Stencils with relief pocket-step in the area of protrusions will solve the problem of gasketing, paste smearing and risk of electrical short

5. Multiple steps can be achieved including step on squeegee side and relief on board side on the same stencil

Zenn Step Stencil Technologies

The SMT step stencil is designed to meet the different amount of tin required for all large and small components on the same PCB. It can be divided into: thickened steel mesh area and thinned steel mesh area.

Partially thickened steel mesh is generally suitable for relatively large components, such as IC grounding, card holders, modules, etc., which require a large amount of tin. Locally thinned stencils are generally suitable for more sophisticated components, such as precision ICs, 0.4-0.5 pitch bga, etc. The amount of tin required is slightly less.

Frequently Asked Questions

1

What information do I need to prepare to custom a laser steel mesh?

It is necessary to provide the steel paste layer data, or PCB working Gerber, and the specific parameters of the steel mesh.

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2

How long does it take to make a laser steel mesh?

Under normal circumstances, after confirming the information and parameters, it can be shipped from China within 48 hours.

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3

What logistics methods are available?

UPS, DHL, FedEx or TNT.

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4

How long does it take to arrive?

The logistics time is about 3-5 days regarding to different countries.

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